Demand for Connectivity and Mobility in Consumer Electronics Fuels Global Semiconductor Assembly and Testing Services Market

The global semiconductor assembly and testing services market has been witnessing an immense rise in the market valuation. According to a research study, published by Persistence Market Research (PMR), the global market for semiconductor assembly and testing services is expected to attain a value of US$29.6 bn by the end of 2015. Analysts estimate this market to expand at a CAGR of 4.70% during the period from 2015 to 2021 and reach US$39.0 bn by the end of 2021.

The rising demand for connectivity as well as mobility in consumer electronic products is driving the global semiconductor assembly and testing services market. Apart from this, the increasing usage of safety systems in automobiles is also propelling the growth of this market to a significant extent.

Read Full Report: http://www.persistencemarketresearch.com/market-research/semiconductor-assembly-test-services-market.asp

However, on the flip side, the need to invest heavily on advanced packaging solutions, coupled with volatility in the market, is projected to slow down the pace of the growth of this market.

The market, however, looks teeming with new opportunities and is likely to demonstrate a substantial growth over the next few years. Here is a snapshot of current as well as historical performance of the global semiconductor assembly and testing services market:

  • Among the services offered in the worldwide semiconductor assembly and testing services market, the assembly and packaging services segment holds the leading position.

  • The market for assembly and packaging services stood at US$22.2 bn in 2014 and is estimated to reach a value of US$23.4 bn by the end of 2015.

  • The rising uptake of consumer electronics products such as smartphones, tablets, and wearable devices are the key driving force behind the immense growth of this market segment.

  • Based on packaging solutions, the wafer level packaging segment has been dominating the global semiconductor assembly and testing services market. Analysts expect it to maintain this trend in the coming years.

  • In 2014, the wafer level packaging segment stood at US$3.5 bn and is likely to reach a value of US$3.8 bn by the end of 2015.

  • The increasing need for high-performance wearable devices with low thermal and power ratings is anticipated to boost the demand for wafer-level packaging inter-connecting solution, resulting in a high market growth. During the period from 2015 to 2021, the market segment is projected to rise at a CAGR of 9.20%.

  • The semiconductor assembly and testing services market is likely to find its biggest application area in the communication segment. However, the consumer electronics segment is expected to report the highest CAGR between 2015 and 2021.

  • In 2014, the consumer electronics segment stood at US$ 3.7 bn and is projected to reach US$4 bn by the end of 2015.

Get Sample Report: http://www.persistencemarketresearch.com/samples/4786

The global market for semiconductor assembly and testing services is distributed among North America, Latin America, the Middle East and Africa, Europe, Asia Pacific excluding Taiwan, and Taiwan. ASE Group, STATS chipPAC Ltd., Silicon Precision Industries Co. Ltd., Powertech Technology Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc., Chipbond Technology Corp., and GlobalFoundries Inc. are the major operators of semiconductor assembly and testing services in the global arena.

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